Physical Sciences › Science des matériaux › Matériaux électroniques, optiques et magnétiques › Copper Interconnects and Reliability

Copper Interconnects and Reliability

This cluster of papers focuses on the development and characterization of low dielectric constant (low-k) materials for microelectronics, with an emphasis on their application in copper metallization and interconnect scaling. The papers cover topics such as electromigration, thin films, plasma processing, diffusion barriers, and the electrical resistivity of nanowires.

Questions & réponses

Aucune question publiée pour cette rubrique. Posez la première ci-dessous.