Physical Sciences › Génie / Ingénierie › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies

Electronic Packaging and Soldering Technologies

This cluster of papers focuses on the advances and challenges in the use of lead-free solders, interfacial reactions between solders and base materials, reliability studies in electronic packaging, high-temperature electronics, nanoparticle applications, electromigration effects, thermal behavior, rare earth element additions, and the use of conductive adhesives as alternatives.

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