Physical Sciences › Génie / Ingénierie › Electrical and Electronic Engineering › 3D IC and TSV technologies

3D IC and TSV technologies

This cluster of papers focuses on the advancements, challenges, and technologies related to Three-Dimensional Integrated Circuits (3D ICs), with a particular emphasis on Through-Silicon Via (TSV) technology, interconnect design, wafer bonding techniques, thermal management strategies, and system integration. The research spans from electrical modeling and microarchitecture to heterogeneous integration and chip stacking.

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