Physical Sciences › Génie / Ingénierie › Biomedical Engineering › Techniques avancées de polissage de surface

Techniques avancées de polissage de surface

This cluster of papers focuses on the techniques, mechanisms, and simulations related to chemical mechanical polishing (CMP) in the context of microelectronics manufacturing. It covers topics such as material removal mechanisms, molecular dynamics simulation, ultra-precision grinding, surface and subsurface damage, nanometric cutting, magnetorheological finishing, polishing slurry chemistry, and tool wear.

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